The flexibility is more rigid, high temperature resistance, no deformation, no sticky tin Use this tool to fix BGA chip, for example, baseband, CPU, etc. It can have a multiplier effect with easy operation Using the best copper material after rolling, extrusion and drawing process Use In good aluminum materials, rolling, polishing and other processes, a breakthrough of the traditional art, the surface feels and the inner hardness reach the best condition, light and comfort. Carefully polished pen-shaped design, breaking through the traditional polishing process. For Mobile Phone Motherboard Disassembly Various Small Parts Package Includes: 1 x Sunshine SS-101A
